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Related Resources on microsystems packaging Fundamentals of Microsystems Packaging Rao Tummala MEMS Packaging Technologies microelectronics sensors electronic packaging Wafer Level Packaging McGraw-Hill RF packaging field's leading author field from wafer to systems packaging and interconnection wafer-level Novices tutorial designed for electrical Written by Rao Tummala Microsystems offers informative reliability testing microelectronics packaging single chip 89.95 packaging design Book Reviews